From FromTechnologies TechnologiestotoMarket Market CSP LED Lighting Modules 2017 Technology, Manufacturing and Applications Trends Market and Technology Report SAMPLE REPORT OBJECTIVES UNDERSTAND CSP LED TECHNOLOGY: • Difference with other packages. • Impact on manufacturing process. • Potential for cost reduction. To understand how CSP LEDs modify the device and module landscape, and identify real opportunities associated to the technology. UNDERSTAND CHANGES IN SYSTEM DESIGN AND INTEGRATION RULES: • Impact on optical design. • Impact on thermal management. • Impact on electrical management. UNDERSTAND PERFORMANCES IN APPLICATIONS: • Positioning of CSP LEDs compared to middle power, high power LED and COB LED modules. • Opportunities for CSP LEDs in applications. UNDERSTAND COMPETITIVE LANDSCAPE AND SUPPLY CHAIN: • Key players. • Impact on the LED supply chain. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 2 METHODOLOGY How did we get to evaluate CSP LED values? • In this report we looked at the CSP values from the integrator perspective. • It means we used our deep understanding of application requirements together with our insights in LED packages architectures and long lasting system (LED luminaires) design capabilities. • Then we integrated all the gathered parameters in our LED based system models and performed optical simulations using ZEMAX Optic Studio 16. • By using the models and optical simulations we were able to understand how the different CSP LED types would perform depending on the application. • Based on this deep understanding we were then able to draw conclusions on the values of CSP LED depending on the applications. Ambiant temperature (°C) • We performed samples light flux and color point characterizations under different current and temperature settings, together with luminance measurement at PISEO's lab. System flux (lm) current (mA) 100 200 400 600 800 1000 -40 264 536 937 1325 1588 1864 -10 254 515 902 1277 1529 1793 10 248 503 879 1244 1491 1739 30 241 489 857 1209 1438 1668 50 235 477 829 1164 1371 1579 60 231 468 813 1133 1333 1533 70 227 459 793 1102 1294 1487 80 222 448 771 1070 1255 1441 100 200 400 600 800 1000 -34 -28 -16 -3 9 22 Driving current If (mA) Tjunction (°C) Ambiant temperature (°C) • We investigated architectures, electrical and thermal behaviors and optical characteristics of CSP LED’s . -40 -10 -4 2 14 26 39 51 10 16 22 34 46 58 71 30 36 42 53 65 78 90 50 56 61 73 85 97 109 60 66 71 83 95 107 119 70 76 81 93 105 117 129 80 86 91 103 115 126 138 Embedded Projector lighting system - Optical design optimization and system performance calculation Sce PISEO – Zemax Optical Studio 16 / Piseo configurator ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 3 REPORT METHODOLOGY Market forecast methodology Market segmentation methodology ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 4 REPORT METHODOLOGY Technology analysis methodology Information collection ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 5 TABLE OF CONTENT (1/3) o About the Authors of the Report P5 o Report Objectives P6 o Companies Cited in This Report P7 o Glossary P8 o Methodology P9 o Executive Summary P10 o Status of the LED Industry and Recent Trends Status of the LED Industry • Introduction - Segmentation of Packaged LEDs • History of the LED Industry P40 • • • • • • • Packaged LED Revenue Forecast - Split by Application 2015 & 2016 in a Nutshell Future Trends LED Market Trends • • Market Landscape Industrial Landscape Key Highlights Displays General Lighting Recent Trends in the LED Industry • Overview • Product Diversification (Level 1) • • • • • • • • LED Filaments COB LEDs Flip Chip (FC) LEDs Chip Scale Packaged (CSP) LEDs Application Diversification - Automotive Lighting Product Diversification (Level 2) - UV LEDs Vertical Integration - LED Module Conclusion o CSP LED Applications Landscape Overview Flash Backlighting General Lighting Automotive Lighting P61 o CSP LED Device Introduction to CSP LED Device • Definition • Benefits CSP LED Device Family Description • Introduction • Size Criterion • Power Density Criterion • CSP or Not CSP? • Power Criterion CSP LED Device Technology • Difference with Other Packages P68 • • • CSP LEDs Structure • • • • • • • Chip Level Package Level Overview Focus on Packaging CSP LEDs in the LED Package Proliferation Flip Chip CSP LEDs vs High Power Type LEDs Wafer Level CSP LED vs High Power Type LED Vertical Thin Film CSP LED vs High Power Type LED Flip Chip packaged CSP LED vs High Power Type LED ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 6 TABLE OF CONTENT (2/3) o CSP LED Device CSP LED Device Manufacturing Process • Conventional LED Manufacturing Process • Flip Chip CSP LED Manufacturing Process • Wafer Level CSP LED Manufacturing Process • CSP LEDs vs Conventional LEDs • Impact on Supply / Value Chain • • Overview Highlights on Phosphor Sheet / Film Suppliers CSP LED Device Cost / Price • Potential for Cost Reduction • The Case of CSP Architecture for Low and Middle Power LEDs • The Case of CSP Architecture for High Power LEDs • Price Positioning of CSP LEDs (Vs. Traditional LEDs) • Price Positioning of CSP LED Modules (Vs. Traditional Modules) CSP LED Device Industry • Key Players Identified • Highlights on US and European Players • Highlights on Japanese Players • Highlights on Korean Players • Highlights on Taiwanese and Chinese Players • Trends - Flow Chart Comparison between Standard, CSP and COB LEDs CSP LED Market o P68 CSP LED Market Volume (2012 - 2021) CSP LED Lighting Module Objectives, Methodology and Synthesis • From Device Characteristics to Performance in Application • System Design and Performance Assessment • Impact of CSP LED Device on System/Module Design • CSP LED System/Module Performance in Application P112 Definition and Types of LED Lighting Modules • Definitions • LED Module in the Global LED Value Chain • The Different Types of LED Modules - Taxonomy • The Different Types of LED Modules - Positioning Main Functions in LED Lighting Modules • System Structure • Parameter Interdependence Optical Design of CSP LED Lighting Modules • Optical Management inside LED Devices • CSP LED Optical Behavior • Light Side Emission of a Package Free CSP LED Device • • • • • Influence of CSP LED Package on Emission Profile Light Emission Profile • • • • • • • • • Introduction Discontinuities Consequences CSP LED FWHM Observations Measurement on Cube and Rim CSPs Light Emitting Surface (LES) and Beam Angle Optical Management in the Application Luminance Control Optical Integration - Single LED and Arrays Shadowing Effect in Close Pack Arrangements Main Consequences and Opportunities of the Optic Properties of CSP LEDs ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 7 TABLE OF CONTENT (3/3) o CSP LED Lighting Module Thermal Management of CSP LED Lighting Modules • Why Thermal Management is Required for LED Systems? • Importance of Thermal Management for LED Reliability • Thermal Path inside the CSP LEDs • CSP Thermal Architecture Compared to Standard LEDs • Thermal Resistance of CSP LEDs • Maximal Junction Temperature of CSP LEDs • Influence Parameters on Thermal Resistance • • • • P112 Size and Power Package Type Substrate/PCB Contact Pads • Thermal Resistance in the Application • Reliability of CSP LEDs Compare to Traditional LED Components • Major Trends in Thermal Management • Main Consequences and Opportunities of the Thermal Properties of CSP LEDs Electrical Management of CSP LED Lighting Modules • Electrical Behavior • Resistive Behavior • Binning Repartition • Multiple LEDs Arrangements • • • • • • • • • • • • • • • • Spotlighting Downlight Outdoor Lighting Linear Tube High Bay Lamp • • • • • Spectrum Control with CSP LEDs CSP LEDs Diversity The Different Types of LED Modules - Positioning CSP LED Module Positioning vs Other Technologies Market Trends - Share of CSP LED Module Revenue (2016 vs. 2021) o Conclusion P208 o Appendix - About Yole Développement P211 o Appendix - About PISEO P230 Introduction Middle and High Power LED Modules CSP LED Modules LED Modules Operating Window LED Balancing Circuit (Electrical Behavior) Electrical Static Discharge (ESD) and Electrical Over Stress (EOS) Electrical Static Discharge (ESD) Protection in LED Package Electrical Static Discharge (ESD) Protection in LED Global System Electrical Management - Minimal Spacing Main Consequences and Opportunities of the Electrical Properties of CSP LEDs Precautions for CSP LED Integration into Modules • Handling Precautions • PCB Design for Optimal Performance • Solder Recommendations • Reflow Process for CSP LEDs CSP LED Lighting Module Performance in Applications • Is a CSP a Cost Effective High Power LED or a Super Mid Power LED? • CSP LEDs in Lighting Products - Positioning • CSP LED vs COB LED • CSP LEDs in Lighting Products - Opportunities • Opportunities for Accent Lighting • Cost Value for Accent Lighting • Opportunities for Spot Light Integration • Opportunities for Global Indoor Application (i.e.: General Lighting) • Integration in General Lighting Applications - Pros & Cons • Integration in General Lighting Applications - Case Study ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 8 ABOUT THE AUTHORS OF THE REPORT Pars MUKISH (Business Unit Manager - LED/OLED, Sapphire and Lighting Systems - Yole Développement) • Pars MUKISH holds a master’s degree in Materials Science & Polymers from ITECH in France and a master’s degree in Innovation & Technology Management from EM Lyon, also in France. He works at Yole Développement, the "More than Moore" market research and strategy consulting company, as Senior Market and Technology Analyst in the fields of LED, OLED, Lighting Technologies and Compound Semiconductors, carrying out technical, economic and marketing analyses. In 2015, Pars has also taken on responsibility for developing LED/OLED and sapphire activities as Business Unit Manager at Yole Développement. Previously, he worked as Marketing Analyst and Techno-Economic Analyst for several years at the French Research Center CEA. Pierrick BOULAY (Market & Technology Analyst - LED/OLED and Lighting Systems - Yole Développement) • Pierrick BOULAY works as a Market and Technology Analyst in the fields of LED, OLED and Lighting Systems, carrying out technical, economic and marketing analysis at Yole Développement, the "More than Moore" market research and strategy consulting company. He has experience in both LED lighting, including general and automotive lighting, and OLED lighting. In the past, he mostly worked in R&D departments for LED lighting applications. Pierrick holds a master’s degree in Electronics from ESEO in France. Dr. Olivier ANDRIEU (System Architect & Senior Research and Innovation Consultant - PISEO) • Dr Olivier Andrieu is an R&D Project Director and Mechatronic and LED System Architect at PISEO. He is working in collaboration with Yole Développement’s team to perform comprehensive technical analyses of innovative LED-based optical systems and markets. His expertise is based on the development of disruptive solutions taking into account mechanical, electronic, optic and thermal issues to achieve application requirements. Previously, Dr Andrieu worked for EFI Automotive as head of innovation and more recently for Philips Lighting where he developed and implemented numerous LED lighting solutions on a global level. Joël THOME (General Manager & Senior Research and Innovation Consultant - PISEO) • Joel Thome is the General Manager & Senior Research & Innovation Consultant at PISEO. In collaboration with Yole Développement’s team, Joel Thome performs numerous technical and market analyses focusing on LED solutions, in addition to developing innovative optical solutions with PISEO’s R&D team. With a Master’s Degree in mechanical engineering, Joel has been working in the lighting industry for more than 25 years. After beginning his career at Philips Lighting, he has recently held various global business, marketing and R&D senior management positions. During this period he developed strong expertise in lighting controls, LED technology and innovation processes including strategic roadmaps and project portfolio management. Today, Joel Thome is also the administrator of the GIL-Syndicat du Luminaire trade union organisation and the Cluster Lumière association. Grégory DUCHENE (Senior Optical Systems Engineer - PISEO) • As a Senior Optical Systems Engineer, Grégory Duchêne is in charge of optics related projects at PISEO. He has created numerous innovative designs for optical systems, based on spectral optimization and light conversion approaches. These disruptive solutions, developed in collaboration with other PISEO experts, are dedicated to general lighting, automotive and imaging applications. Gregory also collaborates with Yole Développement analysts to perform comprehensive technical and marketing analyses focusing on LED lighting modules. Before PISEO, he worked for over ten years on the development of optical designs, including control benches, LED-based lighting systems, CMOS and CCD sensors, signal processing solutions and more. Gregory Duchene has a Master’s Degree in optics from the Institut d’Optique Graduate School (IOGS - France). ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 9 Report sample 10 CSP LED APPLICATIONS LANDSCAPE Overview Time 2014 Applications: Some Integrators: 2015 Flash for Smartphone 2016 Back Light Unit for TV 2017 General Lighting Automotive Lighting Probably : • Flashlight is the main applications for CSP LEDs. Due to their small form factor and ability to deliver high lumen output, CSP LEDs have a fast growth in this market. Moreover, a trend in flashlight application is to use multiple LEDs to implement a dual color flash. • TV manufacturers are using CSP LED because of their small for factor and their large beam angle. It allow to reduce the thickness of the panel and reduce the number of LEDs used in. • General lighting is the latest industry using CSP LEDs in luminaire. It will be used for large area lighting, spot lighting applications or to bring new functionalities like tunable white applications. • CSP LED are being developed to be used in headlamp application for automotive lighting with higher reliability compared to traditional LEDs. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 11 CSP LED DEVICE - INTRODUCTION Definition What is Chip Scale Package (CSP)? • CSP are novel to the LED industry but they are the mainstay of the semiconductor industry. Development of CSP in the Silicon ICs was driven by miniaturization, improved thermal management, higher reliability, and simply the need to connect to an ever increasing pin-count on an ever shrinking die. Chip Scale Packages also enabled a reduction in device parasitic and allowed for ease of integration into Level 2 packaging (e.g.: module packaging for LED). It is therefore a natural evolution for such packaging innovation to proliferate into other industries (such as the LED industry). • Basically, a CSP represents a single chip direct mountable package that have the same size as the chip. • In reality, the package must have an area no larger than 1.2 times that of the die. • Regarding LED device, CSPs are made of blue Flip Chip LED die on which a phosphor layer is coated (as main application of such package is General Lighting). • Flip Chip technology is an enabling technology to develop CSP as such package require no wire bonding (to have package size at the chip scale level). TSMC Chip Scale Package Source: TSMC Samsung Chip Scale Package Source: Samsung • As getting rid of several process steps of traditional LED packaging, CSPs are also impacting the industry structure with some LED chip manufacturers directly supplying their products to LED module manufacturers. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 12 CSP LED DEVICE - FAMILY DESCRIPTION CSP LEDs Definition - Power Density Criterion LEDs technologies have their own power range : CSP LED While traditional LEDs are split in different categories, CSP LEDs are part of both high or mid-power LEDs. High Power LED • Middle Power LED : 0 < MP < 1 W • CSP LED : 1 < CSP < 7 W • High Power LED : 3 < HP < 8,5 W High Power Middle Power Middle Power LED CSP LED High Power LED CSP LEDs can be separated into 2 groups according to their power range : • Middle Power CSP: from 1 W to 3 W • High Power CSP: from 3 to 7 W Middle Power LED ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 13 CSP LED DEVICE - TECHNOLOGY CSP LEDs Structure - Focus on Packaging User perspective is focused on external packaging properties, more than internal structure. "Cube Design" CSP Packaging without walls • Two types of packaging can be observed, according to the presence or not of walls around the LED. Silicone Encapsulated • Cube design • Rim design • The “cube design” appears new on the market and offer singular optical properties. • The “rim design” has a conventional behavior compared to the cube design Package Free Vertical thin film "Rim Design" CSP Packaging with walls Ceramic Substrate Entirely Package X Wafer Level Chip Flip Chip X ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 14 CSP LED DEVICE - TECHNOLOGY Flip Chip packaged CSP LED vs High Power Type LED • The last known CSP structure is a packaged Flip Chip LED • Like the Vertical Thin Film CSP, this packaged FC structure enables to introduce an ESD protection diode inside the LED package High Power type LED Flip Chip packaged CSP LED Lens Spectral converter (White LED) Power to light conversion Encapsulate Reflector Lead frame Optical extraction functions : light extraction, internal reflection Substrate LED chip Bond wire Die attach substrate SMD pads – cathode/anode Thermal pad Silicone Over mold Phosphor LED chip White Silicone Underfill Substrate Get the power in / out Thermal extraction SMD pads – cathode/anode ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 15 CSP LED DEVICE - MANUFACTURING PROCESS Flip Chip CSP LED Manufacturing Process In the Flip Chip CSP LED manufacturing process, interconnection, encapsulation and lens attach steps have been removed compared to conventional LED process Epi Wafer LED Chips on Epi Wafer Attach on substrate Die formation by epitaxy Singulation Die Substrate Chip formation Flip Chip CSP LED Cutting tape Thermal pad Thermal pad Transfer & Singulation Phosphor dispensing Chip transfer & binning LED Packaging ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 16 CSP LED - COST / PRICE Price Positioning of CSP LEDs (Vs. Traditional LEDs) • LED CSP ASP is clearly at an intermediate level between Mid Power and High Power LED. • The price level reflects the success of the cost breakdown made by suppressing a large part of the packaging. • However, the ratio Power to Cost is similar to the other packages and not technology dependent. The price is also market oriented, with a clear trend of lm/$ control. Power Range (W) Traditional High Power LEDs 4 CSP LEDs Middle Power - High Power 3 2 Traditional Middle Power LEDs 1 0 Type of LED ASP Traditional middle power LEDs $0,01 to $0,10 CSP middle power LEDs $XX CSP high power LEDs $XX Traditional high power LEDs $XX Single LED ASP1 ($) 0,25 0,50 0,75 ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 17 CSP LED - INDUSTRY Key Players Identified UK: Xxx In 2013, Lumileds was the first to commercialize LEDs in CSP format. But several other manufacturers (mostly Taiwanese) and material suppliers were also following the same development trends. Japan: Xxx, Xxx, Nichia, (…) South Korea: Seoul, Xxx (…) Germany: Osram1 US: Xxx, Lumileds, Xxx Taiwan: Edison Opto, Xxx(…) 1Manufacturer of CSP-like LEDs China: Xxx (…) ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 18 CSP LED - MARKET CSP LED Volume Forecast (2012 - 2021) CSP LEDs represented a market volume of 2.3B units in 2016 and should grow to a size of Xx B units in 2021. As a reference, in 2016, HP LEDs represented a volume of 25.4B units , and MP LED a volume of 76.7 Bunits. Note: CSP LEDs “are / will be” used both in middle power and high power LEDs. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 19 CSP LED LIGHTING MODULE - OBJECTIVES, METHODOLOGY AND SYNTHESIS Impact of CSP LED Device on System/Module Design Key System/Module Parameters CSP LED Devices have specific characteristics which offer certain advantages but also require particular attention for integration. Key characteristics of CSP LED Devices Thermal Management To ensure life time and luminous efficacy • • • • Optical Design To shape the light beam • Small dimensions • Xxx • Xxx • • • • Small size permitting close pack • Xxx • Xxx • Xxx • Xxx • Take special precautions (design, manufacturing, logistics) Electrical Management To ensure optimal performances Beneficial property Less thermal interfaces Xxx Xxx Small soldering surface Impact on System/Module Critical property that may impact module integration • Xxx • Heat sink to keep a low Tj • Xxx Need for a perfect optical alignment Xxx Xxx ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 20 CSP LED LIGHTING MODULES - THERMAL MANAGEMENT Thermal Path inside the CSP LEDs • Direct connection to metal parts (solder bump, lead frame) allows good thermal conduction between materials. CSP LED shows a direct thermal path from active layer to solder pads Flip Chip CSP Heat production areas • Low number of interfaces participates to the improvement of the thermal conduction. • Difference between the LED chip temperature and the solder pad temperature is reduced compared to standard LED chip Wafer Level CSP Heat transfer Active layer Active layer Xxx Xxx Xxx Solder pads Solder pads ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 21 CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS Is a CSP a Cost Effective High Power LED or a Super Mid Power LED? • High Power LED & CoB modules: • High luminous luminous density. efficacy with moderate • Cree XQ-E module: • Cree XQ-E has the same internal structure as HP and MP LED (chip connected with wire bonds), but its size is closer to CSP LED. • XQ-E follows High Power LED tendency. • CSP LED module: High luminous density but moderately effective. • Mid Power LED module: High efficacy but very poor luminous density. Luminous performances of CSP LED modules are closer to CoB and High Power LED modules than Mid Power LED modules. Those performances can be correlated to the internal structure as shown by Cree XQ-E LED which has a chip scaled size but wire bonded. Luminous performances of different LED technology modules ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 22 CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS CSP LEDs in Lighting Products - Positioning Highbay Outdoor Accent Lamps … • CSP LED have clearly been created by the major LED manufacturer to fill the gap between Mid Power LED and High Power LED. Product CSP LED allows more flux than a Mid Power LED, with a better cost than High Power LED • This technology doesn’t have the required performances qualities to directly compete Mid Power LED Office neither High Power LED. Retail • lm/$ is too low compared to the achievable Hospitality lm/$ based on Mid Power LED. Lamps… High Power LED • Lower performances than High Power LED: lm/W, optical properties, thermal properties. • However, properties like embedded power, light flux performance, diversity of color, CCT, CRI allow much more possibilities than those achieved with mainstream Mid Power LED. • This open the way for intermediate products, between core market and high level positioning, which suffer today from low competitivity or bad perceived performance. More flux CSP LED Less cost Mid Power LED System cost ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 23 CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS CSP LED Module Positioning vs Other Technologies Complete analysis in the report! Mainstream technology Can be used but not mainstream Custom solution mostly Opportunities to be evaluated Middle Power LED Module High Power LED Module COB LED Module CSP LED Module High Bay / Low Bay Spot Lighting Troffer MAIN LUMINAIRE TYPE Downlight Linear Lighting Street Lighting Wall Washer LAMP Automotive Headlamp ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 24 CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS Market Trends CSP LEDs represented less than 1% of LED module business in 2016. It should represent more nearly 6% by 2021. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 25 RELATED REPORTS Discover more related reports within our bundles here. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 26 CSP LED LIGHTING MODULES Market & Technology report - February 2017 CSP LED lighting modules: a potential revolution for the LED industry? KEY FEATURES OF THE REPORT et the sample of the report G on www.i-Micronews.com • CSP LED device technology, manufacturing and industry • CSP LED application landscape • CSP LED module pros and cons, and impact on supply/value chain • CSP LED module design: thermal management, optical design, power supply and driver OBJECTIVES OF THE REPORT Objectives are to understand: CSP LED technology: • Differences from other packages • Impact on manufacturing processes • Potential for cost reduction Changes in system design and integration rules: • Impact on optical design • Impact on thermal management • Impact on electrical management Performances in applications: •Positioning of CSP LEDs compared to mid-power, high-power LEDs and COB LED modules •Opportunities for CSP LEDs in applications Competitive landscape and supply chain: • Identify key players • Impact on the LED supply chain CSP LEDS: A PROMISING SOLUTION WITH CHALLENGES TO OVERCOME Chip-scale packages (CSPs) are new to the LED industry, but are the mainstay of the traditional semiconductor industry, where they improve reliability, thermal management and enable smaller packages. CSP LEDs can be less than a tenth of the size of high and middle power LEDs, increasing power density and simplifying integration into final products. This new architecture can also lower thermal resistance, improve reliability and widen viewing angles compared to other traditional packages. However, there are also several challenges to overcome at the device manufacturing and module integration levels. These include color uniformity, chemical stability, given there is little to no sealing off from the external environment, and control of optical properties like the radiation pattern. In this context, Yole Développement estimates that CSP LED modules represented less than 1% of the LED module business in 2016. However, with strong potential in multiple applications and the lighting industry getting experience with integrating such technology, we forecast a market share of nearly 6% by 2021. This report provides a comprehensive analysis of CSP LED devices, with analyses including: chip and package technology, manufacturing processes, related costs/prices, industry and market trends. The report details deeply analyses CSP LED lighting module design, with focuses including: optical design, thermal and electrical management and precautions for CSP LED integration. LED lighting module market revenue in 2021 Breakdown by module technology in US$ CSP LED module 5.6% Others (Middle power LED module, high power LED module, COB LED module) 94.4% RELATED REPORTS Benef it from our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages A CSP LED market size multiplied by more than 3 since 2016 (Yole Développement, February 2017) AFTER SMARTPHONES AND TVS, A POTENTIAL REVOLUTION IN GENERAL AND AUTOMOTIVE LIGHTING APPLICATIONS? • Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 • LED Packaging 2017: Market, Technology and Industry Landscape •Automotive Lighting: Technology, Industry, and Market Trends • U V LEDs - Technology, Manufacturing and Application Trends Find all our reports on www.i-micronews.com CSP LEDs add value through power density offered from a small surface. The first targeted application was smartphone flashes. As smartphones get thinner and add functions, so too must integrated components/modules. The small form factor and wide beam angle of CSP LEDs have also driven their use in TV backlighting units. Wide beam angles mean the pitch between LEDs can be larger, reducing the number of devices needed and in turn lowering backlight cost. But CSP LEDs are also a means to develop new functions in lighting products. Some general lighting applications are likely to adopt these light sources to reduce the cost of the lamp/luminaire. Their small size enables LED clusters, similar to chipon-board (COB) LED modules but with more functionality. CSP LED clusters promise tunable white, human centric light (HCL), intended to promote a person’s well-being, mood and health, and others smart lighting functions. Last but not least, high luminance and uniformity will mean CSP LEDs enter automotive headlamp applications, which requires high intensity and beam shape control. New developments in CSP LED LIGHTING MODULES matrix headlamps will include CSP LEDs to increase matrix resolution, enhance driver vision and improve Advanced Front Light Systems (AFLS) in combination with cameras. In this report, Yole Développement maps the CSP LED application landscape. It analyses CSP LED lighting module performance in general lighting applications, identifying opportunities, describing case studies, and comparing positioning against other module technologies. CSP LED application landscape Time 2015 2014 Flash smartphone APPLICATIONS: 2016 Backlighting unit for TV 2017 General lighting Automotive lighting Probably: EXAMPLE OF INTEGRATORS: (Yole Développement, February 2017) SIMPLIFIED MANUFACTURING PROCESS IMPACTS THE SUPPLY/VALUE CHAIN CSP LED technology eliminates some package assembly and die attach stages. This is likely to benefit to LED chip manufacturers, who can develop packages and supply them directly to LED module manufacturers more easily, bypassing their traditional customers, and so increasing their profits. Vertically integrated LED manufacturers can also decrease their packaging costs. However, adopting the Comparison between standard, COB and CSP LED module manufacturing chain LED die / Chip Standard low / middle / high power LED module LED Chip manufacturing COB LED module LED Chip manufacturing CSP LED module Packaged LED Standard LED package manufacturing Light / LED module Standard LED module manufacturing COB LED manufacturing LED Chip + CSP LED manufacturing CSP LED module manufacturing COB is considered as a module itself. Therefore, there is no need for a module manufacturer in the manufacturing chain. CSP LEDs can be made by chip manufacturers because most of the package steps are removed. However,additional expertise is required, for example in applying phosphores (Yole Développement, February 2017) technology requires development of new expertise, modifying the traditional packaging landscape. For example, phosphor and encapsulant deposition processes will move from dispensing to phosphor sheet/film deposition or molding. This evolution affects equipment and material suppliers, who have to develop new solutions. Operationally, Lumileds was the first company to commercialize LEDs in CSP format in 2013. The company was rapidly followed by several other players, mostly Taiwanese. But some others, like Osram, still have doubts about the necessity of such technology, and instead are positioned toward traditional middle and high power LEDs, including COBs. This debate is also relevant at the LED module level, where CSPs cause some difficulties. For example, during PCB design, special care should be given to copper traces and solder masks for optimum performance. Some critical properties, like their small soldering surfaces and sideways light emission, may impact module integration. And while the benefits of CSP LEDs are not yet clear for them, they question the real opportunity of this solution. This report provides insights into the changes in manufacturing and integration processes CSP LEDs bring, and potential consequences on the supply/value chain. Additionally, it analyses real opportunities for such technologies based on simulations and case studies. COMPANIES CITED IN THE REPORT (non exhaustive list) Apple, AT&S, Audi, BMW, BREE Optronics, Bright LED, Carclo, Cree, Dow Corning, Edison Opto, Epistar, ETI, Everlight, Fraen, Genesis Photonic Inc., Haeusermann, Hakko, Harvatek, Honglitronics, Huawei, ITRI, Jufei, Kathod, Kingbright, Ledil, Lextar, LG, Lite On, Luminus Devices, Mason, Maven Optronics, MercedesBenz, MLS, Nationstar, Nichia, Oasis, Opel, Optotech, Osram, Philips Lumileds, Plessey Semiconductors, Refond, Samsung, Sanan, Seoul Semiconductors, Toshiba, Toyoda Gosei, Tridonic, Trilux, TSMC, Unistars Mercury, Unity Opto, Wellypower... MARKET & TECHNOLOGY REPORT YOLE DÉVELOPPEMENT TABLE OF CONTENTS (complete content on i-Micronews.com) About the authors of the report Report objectives Companies cited in this report Glossary Methodology Executive summary Status of the LED industry and recent trends 5 6 7 8 9 10 40 > Status of the LED industry including - Introduction - Segmentation of packaged LEDs - History of the LED industry - Packaged LED revenue forecast - Split by application - 2015 and 2016 in a nutshell - Future trends - LED market trends > Recent trends in the LED industry - Overview - Product diversification (Level 1) - Application diversification - Automotive lighting - Product diversification (Level 2) - UV LEDs - Vertical integration - LED module - Conclusion CSP LED application landscape 61 > Overview > Flash > Backlighting > General lighting > Automotive lighting CSP LED devices 68 > Introduction to CSP LED devices - Definition - Benefits > CSP LED device family description - Introduction - Size criterion - Power density criterion - CSP or not CSP? - Power criterion > CSP LED device technology - Differences from other packages - CSP LED structures - CSP LEDs in LED package proliferation - Flip Chip CSP LEDs vs high power-type LEDs - Wafer Level CSP LEDs vs high power-type LEDs - Vertical thin film CSP LEDs vs high power-type LEDs - Flip Chip packaged CSP LEDs vs high power-type LEDs > CSP LED device manufacturing process - Conventional LED manufacturing process - Flip Chip CSP LED manufacturing process - Wafer Level CSP LED manufacturing process - CSP LEDs vs conventional LEDs - Impact on supply/value chain > CSP LED device cost/price - Potential for cost reduction - The case of CSP architecture for low and middle power LEDs - The case of CSP architecture for high power LEDs - Price positioning of CSP LEDs vs. traditional LEDs - Price positioning of CSP LED modules vs. traditional modules > CSP LED device industry - Key players identified - Highlights of US and European Players - Highlights of Japanese Players - Highlights of Korean Players - Highlights of Taiwanese and Chinese Players - Trends - Flow chart comparison between standard, CSP and COB LEDs > CSP LED market - CSP LED market volume (2012 - 2021) CSP LED lighting module 112 > Chip singulation - Objectives, methodology and synthesis - From device characteristics to performance in applications - System design and performance assessment - Impact of CSP LED device on system/module design - CSP LED system/module performance in application > Definition and types of LED lighting modules - Definitions - LED module in the overall LED value chain - The different types of LED modules – Taxonomy - The different types of LED modules – Positioning > Main functions in LED lighting modules - System structure - Parameter interdependence > Optical design of CSP LED lighting modules - Optical management inside LED devices - CSP LED optical behavior - S ideways light emission of a package-free CSP LED device - Influence of CSP LED package on emission profile - Light emission profile - Light Emitting Surface (LES) and beam angle - Optical management in the application - Luminance control - Optical integration - Single LED and arrays - Shadowing effect in close pack arrangements - Main consequences and opportunities of the optical properties of CSP LEDs > Thermal management of CSP LED lighting modules - Why is thermal management required for LED systems? - Importance of thermal management for LED reliability - Thermal path inside the CSP LEDs - CSP thermal architecture compared to standard LEDs - Thermal resistance of CSP LEDs - Maximal junction temperature of CSP LEDs - Influence parameters on thermal resistance - Thermal resistance in the application - Reliability of CSP LEDs compare to traditional LED components - Major trends in thermal management - Main consequences and opportunities arising from the thermal properties of CSP LEDs > Electrical management of CSP LED lighting modules - Electrical behavior - Resistive behavior - Binning distribution - Multiple LED arrangements - LED module operating window - LED balancing circuit (electrical behavior) - Electrical Static Discharge (ESD) and Electrical Over Stress (EOS) - Electrical Static Discharge (ESD) protection in LED package - Electrical Static Discharge (ESD) protection in LED global system - Electrical management - Minimal spacing - Main consequences and opportunities of the electrical properties of CSP LEDs > Precautions for CSP LED integration into modules - Handling precautions - PCB design for optimal performance - Solder recommendations - Reflow process for CSP LEDs > CSP LED lighting module performance in applications - Is a CSP a cost effective high power LED or a super mid power LED? - CSP LEDs in lighting products - Positioning - CSP LED vs COB LED - CSP LEDs in lighting products - Opportunities - Opportunities for accent lighting - Cost value for accent lighting - Opportunities for spot light integration - Opportunities for global indoor application (i.e.: general lighting) - Integration in general lighting applications - Pros and cons - Integration in general lighting applications - Case studies - Spectrum control with CSP LEDs - CSP LED diversity - The different types of LED modules - Positioning - CSP LED module positioning vs other technologies - Market trends - Share of CSP LED module revenue (2016 vs. 2021) Conclusion Appendix - About Yole Développement Appendix - About PISEO 208 211 230 Pars MUKISH holds a master’s degree in materials science and polymers from ITECH in France and a master’s degree in innovation and technology management from EM Lyon in France. Since 2015, Mukish has taken on responsibility for developing LED, OLED and sapphire activities as Business Unit Manager at Yole Développement. Previously, he worked as Marketing Analyst and Techno-Economic Analyst for several years at the French Research Center, CEA. Pierrick BOULAY works as Market and Technology Analyst in the fields of LED, OLED and lighting systems, doing technical, economic and marketing analysis at Yole Développement, the “More than Moore” market research and strategy consulting company. He has experience in both LED lighting, including general lighting and automotive lighting, and OLED lighting. In the past, he mostly worked in R&D departments for LED lighting applications. Pierrick holds a master degree in Electronics from ESEO in France. PISEO Dr Olivier ANDRIEU is R&D Project Director and Mechatronic and LED System Architect at PISEO. He is working in collaboration with Yole Développement’s team to perform comprehensive technical analyses of innovative LED-based optical systems and markets. His expertise is based on the development of disruptive solutions taking into account mechanical, electronic, optic and thermal issues to achieve application requirements. Previously, Dr Andrieu worked for EFI Automotive as head of innovation and more recently for Philips Lighting where he developed and implemented numerous LED lighting solutions on a global level. Joel THOME is the General Manager and Senior Research and Innovation Consultant at PISEO. In collaboration with Yole Développement’s team, Thome performs numerous technical and market analyses focusing on LED solutions, in addition to developing innovative optical solutions with PISEO’s R&D team. With a master’s degree in mechanical engineering, Thome has worked in the lighting industry for more than 25 years. After beginning his career at Philips Lighting, he has recently held various global business, marketing and R&D senior management positions. During this period he developed strong expertise in lighting controls, LED technology and innovation processes including strategic roadmaps and project portfolio management. Today, Thome is also the administrator of the GIL-Syndicat du Luminaire trade union organisation and the Cluster Lumière association. 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All reports are delivered electronically at payment reception. For French customers, add 20% for VAT I hereby accept Yole Développement’s Terms and Conditions of Sale(1) Signature: (1) *One user license means only one person at the company can use the report. Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: February 23, 2017 SHIPPING CONTACT First Name: Last Name: Email: Phone: ABOUT YOLE DEVELOPPEMENT ABOUT PISEO Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management. The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business. A unique innovation platform dedicated to smart LED based optical systems. PISEO owns high skilled engineers and cutting edge characterization equipment, all situated in a single location. The team, mainly issued from an industrial global leader, delivers a whole set of services to the industry throughout the entire product life cycle. 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From Technologies to Market Presentation of Yole Développement With Focus on Solid State Lighting (LED, OLED…) and Display Activities Corporate Presentation Yole Développement From Technologies to Market ©2017 | www.yole.fr | CSP LED Lighting Module | Sample 28 FIELDS OF EXPERTISE Imaging MEMS & Sensors Photonics RF (Devices & Technologies) Displays Our 30 analysts operate in the following areas. MedTech Solid State Lighting (LED, OLED…) Manufacturing Compound Semi. Advanced Packaging Power Electronics Advanced Substrates Batteries / Energy Management ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 29 4 BUSINESS MODELS Consulting and Analysis Financial services • Market data & research, marketing analysis • M&A (buying and selling) • Technology analysis • Due diligence • Strategy consulting • Fundraising • Reverse engineering & costing • Maturation of companies • Patent analysis • IP portfolio management & optimization www.yole.fr www.yolefinance.com / www.bmorpho.com Reports Media • Market & Technology reports • i-Micronews.com website • Patent Investigation and patent infringement risk analysis • @Micronews e-newsletter • Teardowns & Reverse Costing Analysis • Cost Simulation Tool www.i-Micronews.com/reports • Technology magazines • Communication & webcast services • Events www.i-Micronews.com ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 30 A GROUP OF COMPANIES M&A operations Due diligences www.yolefinance.com Innovation & Business maker www.bmorpho.com Market, technology and strategy consulting www.yole.fr Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools www.systemplus.fr IP analysis Patent assessment www.knowmade.fr Test & Measurement Expertise Research & Innovation www.piseo.fr ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 31 OUR GLOBAL ACTIVITY Europe office Frankfurt Paris Nantes Yole Korea HQ in Lyon Seoul Vénissieux Yole Japan Yole Inc. Phoenix Tokyo Nice 40% Greater China office Hsinchu of our business 30% 30% of our business of our business ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 32 RESEARCH PRODUCTS - CONTENT COMPARISON Breadth of the analysis Depth of the analysis Standard Reports Workshops Custom Analysis Custom analysis scope is defined with you to meet your information and budget needs ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 33 SERVING THE ENTIRE SUPPLY CHAIN Integrators and end-users Our analysts provide market analysis, technology evaluation, and business plan along the entire supply chain. Device makers Suppliers: material, equipment, OSAT, foundries… Financial investors, R&D centers ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 34 SERVING MULTIPLE INDUSTRIAL FIELDS Industrial and defense We are working accross multiples industries to understand the impact of Morethan-Moore technologies from device to system. Energy Transportation makers Medical systems Automotive Mobile phone and consumer electronics From A to Z… ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 35 REPORTS COLLECTION o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in: • MEMS & Sensors. • • • • • RF devices and technologies. Imaging. Medical Technologies (MedTech). Photonics. Advanced packaging. • • • • • • Manufacturing. Power electronics. Batteries & Energy management. Compound semiconductors. LED. Displays. o You are looking for: • An analysis of your product market. • A review of your competitors evolution. • An understanding of your manufacturing and production costs. • An understanding of your industry technology roadmap and related Ips. • www.i-Micronews.com A clear view on the evolution of the supply chain. Our team of 50+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape. In the past 18 years, we worked on more than 1?500 projects, interacting with technology professional and high level opinion makers from the main players of the industry. o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. o Take the full benefit from our Bundle and Annual Subscription offers. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 36 OUR 2017 REPORTS PLANNING (1/2) MARKET AND TECHNOLOGY REPORTS by Yole Développement o MEMS & SENSORS − Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017 − MEMS Microphones, Speakers and Audio Solutions 2017 − Status of the MEMS Industry 2017 − MEMS & Sensors for Automotive 2017 − High End Inertial Sensors for Defense and Industrial Applications 2017 − Sensor Modules for Smart Building 2017 − Sensing and Display for AR/VR/MR 2017 (Vol 1) − MEMS Packaging 2017 − Magnetic Sensors Market and Technologies 2017** − Microspectrometers Markets and Applications 2017** o o RF DEVICES AND TECHNOLOGIES − RF Components and Modules for Cellphones 2017 − Advanced RF SiP for Cellphones 2017 − 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals 2017 − 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals 2017 − RF Technologies for Automotive Applications 2017 − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 IMAGING & OPTOELECTRONICS − 3D Imaging & Sensing 2017 − Status of the CMOS Image Sensor Industry 2017 − Camera Module for Consumer and Automotive Applications 2017 − Uncooled Infrared Imaging Technology & Market Trends 2017 − Active Imaging and Lidars 2017 (vol 1) o MEDTECH − Status of the Microfluidics Industry 2017 − Solid State Medical Imaging 2017 − Sensors for HomeCare 2017 − Sensors for Medical Robotics 2017 − Organs-on-a Chip 2017 o ADVANCED PACKAGING − Advanced Substrates Overview 2017 − Status of the Advanced Packaging Industry 2017 − Fan Out Packaging: Market & Technology Trends 2017 − 3D Business Update: Market & Technology Trends 2017 − Advanced QFN: Market & Technology Trends 2017** − Inspection and Metrology for Advanced Packaging Platform 2017** − Advanced Packaging for Memories 2017 − Embedded Die Packaging: Technologies and Markets Trends 2017 o MANUFACTURING − Glass Substrate Manufacturing 2017 − Equipment & Materials for Fan Out Technology 2017 − Equipment & Materials for 3D T(X)V Technology 2017 − Emerging Non Volatile Memories 2017 ** To be confirmed ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 37 OUR 2017 REPORTS PLANNING (2/2) MARKET AND TECHNOLOGY REPORTS by Yole Développement o POWER ELECTRONICS − Status of Power Electronics Industry 2017 − Power Mosfets Market and Technology Trends 2017 − IGBT Market and Technology Trends 2017 − Power Packaging Market and Technology Trends 2017 − Power SiC 2017: Materials, Devices, and Applications − Power GaN 2017: Materials, Devices, and Applications − Materials Market Opportunities for Cellphone Thermal Management (Battery Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017 − Gate Driver Market and Technology Trends in Power Electronics 2017 − Power Management ICs Market Quarterly Update 2017 − Power Electronics for Electrical Aircraft, Rail and Buses 2017 − Thermal Management for LED and Power 2017 o BATTERY AND ENERGY MANAGEMENT − Status of Battery Industry for Stationary, Automotive and Consumer Applications 2017 o COMPOUND SEMICONDUCTORS − Power SiC 2017: Materials, Devices, and Applications − Power GaN 2017: Materials, Devices, and Applications − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 − Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017 o DISPLAYS − Microdisplays and MicroLEDs 2017 − Display for Augmented Reality, Virtual Reality and Mixed Reality 2017 − QD for Display Applications 2017 − Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays − Emerging Display Technologies 2017** o SOLID STATE LIGHTING (LED, OLED…) − UV LEDs 2017 - Technology, Manufacturing and Application Trends − Agricultural Lighting 2017 - Technology, Industry and Market Trends − Automotive Lighting 2017 - Technology, Industry and Market Trends − Active Imaging and Lidar 2017 (Vol 2) - IR Lighting** − LED Lighting Module 2017 - Technology, Industry and Market Trends − IR LEDs 2017 - Technology, Manufacturing and Application Trends − Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays − CSP LED Lighting Modules 2017 − LED Packaging 2017 - Market, Technology and Industry Landscape PATENT ANALYSIS by Knowmade − − − − − − − − − − 3D Monolithic Memory: Patent Landscape Analysis Microfluidic Diagnostic: Patent Landscape Analysis GaN Technology: Top-100 IP profiles** Uncooled Infrared Imaging: Patent Landscape Analysis** MEMS Microphone: Patent Landscape Analysis** MEMS Microphone: Knowles' Patent Portfolio Analysis** MicroLEDs: Patent Landscape Analysis** Microbolometer: Patents used in products** Micropumps: Patent Landscape Analysis** Flexible batteries: Patent Landscape Analysis** TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be published in 2017. ** To be confirmed ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 38 OUR 2016 PUBLISHED REPORTS LIST MARKET AND TECHNOLOGY REPORTS by Yole Développement o MEMS & SENSORS − Gas Sensors Technology and Market 2016 − Status of the MEMs Industry 2016 − Sensors for Cellphones and Tablets 2016 − Market and Technology Trends of Inkjet Printheads 2016 − Sensors for Biometry and Recognition 2016 − Silicon Photonics 2016 o IMAGING & OPTOELECTRONICS − Status of the CMOS Image Sensor Industry 2016 − Uncooled Infrared Imaging Technology & Market Trends 2016 − Imaging Technologies for Automotive 2016 − Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016 o MEDTECH − BioMEMS 2016 − Point of Care Testing 2016: Application of Microfluidic Technologies o ADVANCED PACKAGING − Embedded Die Packaging: Technology and Market Trends 2017 − 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016 − Fan-Out: Technologies and Market Trends 2016 − Fan-In Packaging: Business update 2016 − Status and Prospects for the Advanced Packaging Industry in China 2016 o MANUFACTURING − Thin Wafer Processing and Dicing Equipment Market 2016 − Emerging Non Volatile Memories 2016 o COMPOUND SEMICONDUCTORS − Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 − Sapphire Applications & Market 2016: from LED to Consumer Electronics − Power SiC 2016: Materials, Devices, Modules, and Applications o LED UV LED Technology, Manufacturing and Applications Trends 2016 OLED for Lighting 2016 – Technology, Industry and Market Trends Automotive Lighting: Technology, Industry and Market Trends 2016 Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 − Organic Thin Film Transistor 2016: Flexible Displays and Other Applications − Sapphire Applications & Market 2016: from LED to Consumer Electronics − − − − o POWER ELECTRONICS − Power Electronics for EV/HEV 2016: Market, Innovations and Trends − Status of Power Electronics Industry 2016 − Passive Components Technologies and Market Trends for Power Electronics 2016 − Power SiC 2016: Materials, Devices, Modules, and Applications − Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends − Inverter Technologies Trends & Market Expectations 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 o BATTERY AND ENERGY MANAGEMENT − Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016 − Stationary Storage and Automotive Li-ion Battery Packs 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 39 CONTACT INFORMATION • Consulting and Specific Analysis • North America: Steve LAFERRIERE, Director of Northern America Business Development,Yole Inc. Email: [email protected] - +1 31 06 008 267 • Greater China: Mavis WANG, Director of Greater China Business Development Email: [email protected] - +886 979 336 809 • Japan & Rest of Asia:Takashi ONOZAWA, General Manager,Asia Business Development Email: [email protected] - +81 3 4405 9204 • RoW: Jean-Christophe ELOY, President & CEO,Yole Développement Email [email protected] - +33 4 72 83 01 80 • Report business • North America: Steve LAFERRIERE, Director of Northern America Business Development Email: [email protected] - +1 31 06 008 267 • Europe: Lizzie LEVENEZ, EMEA Business Development Manager Email: [email protected] - +49 15 123 544 182 • Rest of Asia:Takashi ONOZAWA, General Manager,Asia Business Development Email: [email protected] - +81 3 4405 9204 • Japan & Asia: Miho OTHAKE, Account Manager Email: [email protected] - +81 3 4405 9204 Follow us on • Greater China: Mavis WANG, Director of Greater China Business Development Email: [email protected] - +886 979 336 809 • Financial services • Jean-Christophe Eloy, CEO & President Email [email protected] - +33 4 72 83 01 80 • General Email: [email protected] - +33 4 72 83 01 80 ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 40 About Solid State Lighting (LED, OLED…) and Display Activities ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 41 FOCUS ON SOLID STATE LIGHTING (LED, OLED…) AND DISPLAY ACTIVITIES Yole is active throughout the value chain (Example of LED and Sapphire activities) Substrate • • • • We are active throughout the value chain: from substrates to systems! And we interact with industrial / R&D players from each level! Front-end Level 0 - Epitaxy Front-end Level 1 - Device Production Nucleation layer n-type layer Active layers (MQW) p-type layer • • • • SiC / Sapphire / Silicon / Bulk GaN / Engineered substrates LED epiwafer Back-End level 1 - Packaging • • • • Inspection Masking / Lithography Etching Metallization / Contacts / Mirrors Mesa LED, Flip Chip LED, Vertical LED structures Back-End Level 0 - Packaging Die Attach & Interconnections Phosphors Encapsulation & Optics Testing & Binning • Substrate separation & Bonding • Die singulation • Testing & Binning LED dies LED dieson-wafer Module Packaging • • • • Packaged LEDs Substrates (PCB) Encapsulation & Optics Heatsink Testing & Binning LED modules LED systems and applications ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 42 FOCUS ON SOLID STATE LIGHTING (LED, OLED…) AND DISPLAY ACTIVITIES Insights on Forecast Methodology (Example of LED and Sapphire activities) APPLICATION “What’s Behind the Crystal Ball?” Only analysts that follow the industry on a daily basis (trough interviews) and developed market modeling tools based on discussions with key players of the industry. Forecast of standard product market volume (unit) Ex.: Smartphone, TVs, lamps (…) Definition of functions using LEDs Ex.: “Flash vs. Keypad” for smartphone (…) Forecast of LED market volume (unit) Split by application, power type (low vs. medium vs. high power), package type (single vs. multi-die…) (… ) System Plus Consulting expertise in reverse costing / reverse engineering Definition of LED die surface (mm²) Definition of LED ASP Per power type, packaged type (…) Definition of LED penetration rate and competitiveness with alternative technologies Definition of technical requirements Ex.: Efficacy, size (…) Ex.: “OLED vs. LED” in smartphone (…) Forecast of LED market size ($) Split by application, power type, package type (… ) Definition of manufacturing flows for front-end and packaging (process, technologies, materials, yields…) Forecast of LED manufacturing equipment and material markets (unit and $) Split by application, power type, package type (…) Ex.: Phosphors, encapsulant, dicing equipment Definition of substrate die surface (mm²) and epiwafer volume (unit) Forecast of LED substrate markets (unit and $) Split by type of substrate (…) Split by type of substrate (…) Definition of sale levels of key manufacturers ($) Ex: LED, packaging materials, epitaxy materials, manufacturing equipment, MOCVD reactor, substrate (…) ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 43 FOCUS ON SOLID STATE LIGHTING (LED, OLED…) AND DISPLAY ACTIVITIES About Yole’s Analyst Team Pars MUKISH - Business Unit Manager - SSL & Display Pars MUKISH holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology Management (EM Lyon - France). Since 2015, Pars MUKISH has taken on responsibility for developing LED, OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center). A team based on persons having complementary skills and expertise. Dr. Eric VIREY - Senior Market & Technology Analyst - Sapphire & Display Eric VIREY holds a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble (INPG - France). He works as Market and Technology Analyst in the fields of Sapphire, LED / OLED and Display. In the last 12 years, he has held various R&D, engineering, manufacturing and marketing positions with Saint-Gobain. Most recently, he was Market Manager at Saint-Gobain Crystals, in charge of Sapphire and Optoelectronic products. Pierrick BOULAY - Market & Technology Analyst - SSL Pierrick BOULAY holds a master degree in Electronics from ESEO (France). He works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience in both LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 44 FOCUS ON SOLID STATE LIGHTING (LED, OLED…) AND DISPLAY ACTIVITIES Report collection Previous Publications: A collection of more than 15 reports on Solid State Lighting and Display. 2017 Publications: • Status of the LED Industry • Thermal Management for LED and Power Electronic - New • LED in Road and Street Lighting • MicroLEDs and MicroDisplays - New • LED Front End • CSP LED Lighting Module - New • GaN-on-Si Technology and Market • Agricultural Lighting - New • Phosphors & QDs - IP Landscape • IR LED - New • Display for Augmented Reality - New 2016 Publications: • QD for Display Applications - New • OLED For Lighting - February 2016 • LED Packaging - Update • Automotive Lighting - April 2016 • Phosphors & QDs - Update • UV LED - August 2016 • UV LED - Update • Sapphire - September 2016 • LED Lighting Module - Update • Organic TFT - October 2016 • Automotive Lighting - Update • Our reports are unmatched in quality and technology depth and typically include: • Technology trends and evolution: costs, barriers, roadmaps (…). • Supply & value chain analysis: business models, relationships (…). In-depth analysis of applications and market drivers: challenges, inflection points (…). • Market data ($, units, wafer starts…). ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample 45
