core-i7-900-ee-and-desktop-processor-series-datasheet-vol-1

Document # 320834-004
Intel® Core™ i7-900 Desktop
Processor Extreme Edition Series
and Intel® Core™ i7-900 Desktop
Processor Series
Datasheet, Volume 1
February 2010

2Datasheet
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Datasheet 3
Contents
1Introduction..............................................................................................................9
1.1 Terminology .....................................................................................................10
1.2 References ....................................................................................................... 11
2 Electrical Specifications...........................................................................................13
2.1 Intel® QPI Differential Signaling..........................................................................13
2.2 Power and Ground Lands....................................................................................13
2.3 Decoupling Guidelines........................................................................................13
2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling.........................................................14
2.4 Processor Clocking (BCLK_DP, BCLK_DN) .............................................................14
2.4.1 PLL Power Supply...................................................................................14
2.5 Voltage Identification (VID) ................................................................................14
2.6 Reserved or Unused Signals................................................................................17
2.7 Signal Groups...................................................................................................18
2.8 Test Access Port (TAP) Connection.......................................................................19
2.9 Platform Environmental Control Interface (PECI) DC Specifications...........................20
2.9.1 DC Characteristics..................................................................................20
2.9.2 Input Device Hysteresis ..........................................................................21
2.10 Absolute Maximum and Minimum Ratings.............................................................21
2.11 Processor DC Specifications ................................................................................22
2.11.1 DC Voltage and Current Specification........................................................23
2.11.2 VCC Overshoot Specification....................................................................29
2.11.3 Die Voltage Validation.............................................................................30
3 Package Mechanical Specifications ..........................................................................31
3.1 Package Mechanical Drawing...............................................................................31
3.2 Processor Component Keep-Out Zones.................................................................34
3.3 Package Loading Specifications ...........................................................................34
3.4 Package Handling Guidelines...............................................................................34
3.5 Package Insertion Specifications..........................................................................34
3.6 Processor Mass Specification...............................................................................35
3.7 Processor Materials............................................................................................35
3.8 Processor Markings............................................................................................35
3.9 Processor Land Coordinates................................................................................36
4Land Listing.............................................................................................................37
5 Signal Descriptions..................................................................................................67
6 Thermal Specifications ............................................................................................71
6.1 Package Thermal Specifications...........................................................................71
6.1.1 Thermal Specifications............................................................................71
6.1.2 Thermal Metrology .................................................................................75
6.2 Processor Thermal Features................................................................................76
6.2.1 Processor Temperature ...........................................................................76
6.2.2 Adaptive Thermal Monitor........................................................................76
6.2.3 THERMTRIP# Signal ...............................................................................79
6.3 Platform Environment Control Interface (PECI)......................................................79
6.3.1 Introduction ..........................................................................................79
6.3.2 PECI Specifications.................................................................................81
6.4 Storage Conditions Specifications ........................................................................82

4Datasheet
7Features..................................................................................................................83
7.1 Power-On Configuration (POC).............................................................................83
7.2 Clock Control and Low Power States.....................................................................83
7.2.1 Thread and Core Power State Descriptions .................................................84
7.2.2 Package Power State Descriptions.............................................................85
7.3 Sleep States .....................................................................................................86
7.4 ACPI P-States (Intel® Turbo Boost Technology) .....................................................86
7.5 Enhanced Intel® SpeedStep® Technology .............................................................87
8 Boxed Processor Specifications................................................................................89
8.1 Introduction......................................................................................................89
8.2 Mechanical Specifications....................................................................................90
8.2.1 Boxed Processor Cooling Solution Dimensions.............................................90
8.2.2 Boxed Processor Fan Heatsink Weight .......................................................92
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....92
8.3 Electrical Requirements ......................................................................................92
8.3.1 Fan Heatsink Power Supply ......................................................................92
8.4 Thermal Specifications........................................................................................93
8.4.1 Boxed Processor Cooling Requirements......................................................93
8.4.2 Variable Speed Fan.................................................................................95
Figures
1-1 High-Level View of Processor Interfaces................................................................. 9
2-1 Active ODT for a Differential Link Example ............................................................13
2-2 Input Device Hysteresis......................................................................................21
2-3 VCC Static and Transient Tolerance Load Lines ......................................................25
2-4 VTT Static and Transient Tolerance Load Line ........................................................27
2-5 VCC Overshoot Example Waveform......................................................................30
3-1 Processor Package Assembly Sketch.....................................................................31
3-2 Processor Package Drawing (Sheet 1 of 2) ............................................................32
3-3 Processor Package Drawing (Sheet 2 of 2) ............................................................33
3-4 Processor Top-side Markings ...............................................................................35
3-5 Processor Land Coordinates and Quadrants (Bottom View)......................................36
6-1 Processor Thermal Profile....................................................................................73
6-2 Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location..........75
6-3 Frequency and Voltage Ordering..........................................................................77
7-1 Power States.....................................................................................................84
8-1 Mechanical Representation of the Boxed Processor .................................................89
8-2 Space Requirements for the Boxed Processor (side view) ........................................90
8-3 Space Requirements for the Boxed Processor (top view) .........................................91
8-4 Space Requirements for the Boxed Processor (overall view) ....................................91
8-5 Boxed Processor Fan Heatsink Power Cable Connector Description............................92
8-6 Baseboard Power Header Placement Relative to Processor Socket.............................93
8-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view).................94
8-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view)................94
8-9 Boxed Processor Fan Heatsink Set Points ..............................................................95

Datasheet 5
Tables
1-1 References ....................................................................................................... 11
2-1 Voltage Identification Definition...........................................................................15
2-2 Market Segment Selection Truth Table for MS_ID[2:0]...........................................17
2-3 Signal Groups...................................................................................................18
2-4 Signals with ODT...............................................................................................19
2-5 PECI DC Electrical Limits ....................................................................................20
2-6 Processor Absolute Minimum and Maximum Ratings...............................................22
2-7 Voltage and Current Specifications.......................................................................23
2-8 VCC Static and Transient Tolerance .....................................................................24
2-9 VTT Voltage Identification (VID) Definition............................................................25
2-10 VTT Static and Transient Tolerance......................................................................26
2-11 DDR3 Signal Group DC Specifications...................................................................27
2-12 RESET# Signal DC Specifications.........................................................................28
2-13 TAP Signal Group DC Specifications .....................................................................28
2-14 PWRGOOD Signal Group DC Specifications............................................................28
2-15 Control Sideband Signal Group DC Specifications...................................................29
2-16 VCC Overshoot Specifications..............................................................................29
3-1 Processor Loading Specifications .........................................................................34
3-2 Package Handling Guidelines...............................................................................34
3-3 Processor Materials............................................................................................35
4-1 Land Listing by Land Name.................................................................................37
4-2 Land Listing by Land Number..............................................................................52
5-1 Signal Definitions ..............................................................................................67
6-1 Processor Thermal Specifications.........................................................................72
6-2 Processor Thermal Profile ...................................................................................73
6-3 Thermal Solution Performance above TCONTROL...................................................74
6-4 Supported PECI Command Functions and Codes....................................................81
6-5 GetTemp0() Error Codes ....................................................................................81
6-6 Storage Conditions............................................................................................82
7-1 Power On Configuration Signal Options.................................................................83
7-2 Coordination of Thread Power States at the Core Level...........................................84
7-3 Processor S-States ............................................................................................86
8-1 Fan Heatsink Power and Signal Specifications........................................................93
8-2 Fan Heatsink Power and Signal Specifications........................................................95